View Issue Details
| ID | Project | Category | View Status | Date Submitted | Last Update |
|---|---|---|---|---|---|
| 0001428 | K18X001.00 SKB SWAN | HW Issue | public | 2022-02-08 13:58 | 2025-04-11 21:22 |
| Reporter | (ALTech) SH Son | Assigned To | (HW) Sean Chiang | Due Date | |
| Priority | urgent | Severity | s3-moderate | Reproducibility | have not tried |
| Status | closed | Resolution | fixed | ||
| Summary | 0001428: [SWAN] [Field issue] AMP FFC and Common mode Filter is malted. | ||||
| Description | I found the defect SET from field (end user), this set FFC cable almost melted. i think this is critial issue and can lead to product fire. Please analyze the root cause asap base. | ||||
| Tags | No tags attached. | ||||
| Attach Tags | |||||
| User List |
(ALTech) BY Lee , (ALTech) JW Kim , (ALTech) Lonnie Kim , (ALTech) Philip , (ALTech) SH Son , (ALTech) Sophie Lee , |
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@Sean please see the detachment more details this issue. also here is Fedex tracking information and shipping documents 7759 6775 7835 Thanks SON |
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Hi, SH Update Fii factory provided FA report for you reference. Thanks ! |
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Hi Tom Lee I think one of root cause is assembly method of AMP ffc cable Please further analysis with defected samples as I sent to Taiwan. Thanks SON |
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Hi, SH We has got the defect sample on last Friday, and start to analyze root cause. But lack of adaptor, PLS delivery the defect adaptor to us. Thanks ! |
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Hi, Tom Why do you need to Adaptor? Best regards Lonnie Kim |
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Hi Loonie, Update the FA report. PCB has returned to PCB vendor for x-section today. Thank you. |
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Hi Mr.Yoon and SH, Please refer to the attachment for the Chinese X-section report provided by the 3rd party Lab. of our supplier. Please have Sophie help to translate for you first. The vendor should be able to provide the English report by tomorrow. Regards, Sean |
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Add the attached file. |
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Hi Sean this report is X-section report not a PCB vender 8D report. my understanding is that the cross section is mainly performed to find the root cause. Please upload the 8d report of the PCB vender The 8D report should included : Why copper remains between A and B of L2 layer Thanks SON |
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Hi SH, Yes, this is x-section report provided by PCB vendor. For 8D report, it needs Fii QA team to prepare it and provide to ALT review instead of vendor. Will let you know the 8D report schedule after confirmed it with our QA team. Thanks, Regards, Sean |
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Hi, SH Attached is English version of X-section report for you reference. Thanks ! Tom |
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Hi, SH Discuss PCB vendor and Fii QA, the root cause should be caused by the residual copper around 24V via in layer 2. Attached are the FA report, PLS review it. Thanks ! |
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Hi Tom Lee 0001428:0009652 Here is feedback after ALT review 1. page 7 : please update the "Simulated FFC cable folding on the top of power choke" result. 2. page 15 : missing of VGT FA report. there are only motioned about the phenomenon, no analysis of why this problem occurred 3. Page 18 : Please make sure that why Residual copper is remained in L2. Cause 1 - what is Foxconn's corrective action? Cause 2 - is that only PCB defect? 4. Page 20 5.1 VGT enhance the AOI inspector training, and as a lesson learnt for this case. -> Please update the before / after SOP from the VGT 5.2 FII continue to monitor the defect rate of PCB. Till now, the defect rate of PCB is 0%. -> Do you guarantee 100% that it will be filtered if a same PCB defect is received? 5. Update D6 (verification) , D7 (prevent) , D8. 6. If the same defect occurs, who is responsible? FII? Factory? or PCB Vender? 7. explane why did not filtered defect from the vender? please update the e-test and AOI test result : D/C2136, L/C202109-0001, 4796pcs Prepare your answers and make a conference call Thanks SON |
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Hi, SH 5. Update D6 (verification) , D7 (prevent) , D8. <Tom> I don't know what you mean. Please explain more in detail. Thanks ! Tom |
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Hi Mr. Tom Lee, Did you provide 8D Report or FA report ? I've heard that Vendor provide FA report. And FII QA makes 8D report based on vendor's FA report. But you provided FA report. So will you provide 8D report again ? Mr. SH Son asked to D6 ~ D8 in 8d Report. Best Regards, SuhYoung YOON |
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Hi SH, 0001428:0009668 Please see my comment as below, Thanks. 2. page 15 : missing of VGT FA report. there are only motioned about the phenomenon, no analysis of why this problem occurred => As you know that the PCB was burned seriously, it's diffcult to determine what went wrong when prodcut used in user's home causing this short issue. 6. If the same defect occurs, who is responsible? FII? Factory? or PCB Vender? => It's no doubt that FII will take responsibility for ALT/SKB directly and vendor will be responsible for FII. 7. explane why did not filtered defect from the vender? => As you can see the page16 in report, vendor use AOI to filter the defect after Etching process. But I think AOI can not filter the defect in 100%, and that's why there is another station call e-test in their process to check the open & short for filtering the defect. As we think this is a single case, our QA team is working with supplier and ask them to improve the AOI process to make sure this type of issue doesn't happen again in the future. The other items will be update again in 8D report. and will send it to you soon next week. Regards, Sean |
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Hi Sean Last concall, the 8D report will be release tomorrow 3/29. so, Let's make a conference call and review 8D report tomorrow afternoon. is it OK? Thanks SON |
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Hi, SH Update Fii QA makes 8D report which add D6~D8 in the report. Please review it. Thanks ! Tom |
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Hi Mr. Sean Chiang, As we discussed last weekly meeting, please add short term solution(assembly guide) on 8D report. There is no comment about it in the report. BR S YOON |
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Hi Sean Chiang and Tom here is ALT feedback as FII 8D report after today conference call. 1. Please update "Simulated FFC cable folding on the top of power choke" report. 2. Please fine the why 24V line and GND was short. - please review root cause and the other possibility of root cause : using the attachment fish born tool to analysis and update on the 8D report 3. update short term solution for mass production. 4. PCB Vender (VGT) FA report 5. If the same defect occurs - fire in the customer's house, How are FII going to respond? Thanks SON |
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Hi, SH I update the PCB Vender (VGT) FA report to you first. I will update other items to you soon. Thanks ! Tom |
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Hi, SH Update "Simulated FFC cable folding on the top of power choke" report. Thanks ! Tom |
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Hi Tom I reviewed test report, the test design was wrong. Please check and follow ALT feedback. and let me know test schedule Thanks SON |
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Hi, SH reply 0001428:0009756 Could Fii PQE use 2nd build sample of 2nd source to verification it ? Thanks ! Tom |
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Hi, SH Because play 450Hz Sine Tone with Max volume that the sound is very loud and affects everybody. PQE should place SWAN in the temperature chamber when testing. But the chamber room don't have internet to access YouTube. Could we play 450Hz Sine Tone via USB Pen driver ? Thanks ! Tom |
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Hi Tom Ok agree below : 2nd source to verification : 450Hz Sine Tone via USB Pen driver if you have any question, please let me know Thanks SON |
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Hi, SH Attached is the new power common filter (LCP top cover) datasheet for you reference. Dimension and performance of new power common filter are the same as current design. Thanks ~ Tom |
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Hi, SH Attached are the description of LCP material and document of UL E54705 for top cover of power common filter. LCP vendor is SUMITOMO. Thanks ~ Tom |
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Hi, Tom As we requested at weekly CC, please check its strength for vibration and shock. Crystal is very fragile material. Please check to vendor. Best regards Lonnie Kim |
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Hi, SH reply :0009756 Update the test report of "Simulated FFC cable folding on the top of power choke" which following ALT's suggestion. The maximun temperature of CHOKE is 66.9 degree C @room temperature 22.6 degree C, temperature rise 44.3 degree C. Thanks ~ Tom |
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Hi Tom Please check the amp FFC cable, it looks like not folded. I think, in this issue is critical point is FFC cable folding between heatspreader. Please check again. |
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Hi, SH reply 0001428:0009883 PQE confirmd that he fold the AMP FFC cable indeed between power choke and heat spreader during test. Thanks ~ Tom |
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HI Tom I check "SOPA ssemble heaksink, Link 96.1531T00.pdf" I think amp FFC cable routing is CTQ (critical to quality). Also FII was defined CTQ point. but factory SOP is not applied. Please update SOP and upload again Thanks Lonnie Kim |
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Hi, Lonnie As today's weekly meeting, I provide the 3M tape datasheet for you reference. This tape be used in current SWAN MP product. Temperature of this tape is 105 degree C. Thanks ~ Tom |
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Hi, Lonnie Attached is the full set vibration test report of BFX-UA300 with new power choke for you reference. The test result are pass. Thanks ~ Tom |
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Hi, SH Attached is the new power choke control run report. Please kindly review it and leave comments. Thanks ! Tom |
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Hi, SH How about review result of new power choke control run report ? Because we plan to issue EC of both new AMP FFC cable and new power choke at the same time. So, PLS review new power choke control run report and feedback comments soon. Thanks ! Tom |
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Hi Tom We reviewed control run result, Please apply for the mass production. Please update the cut-in information (first applied new power choke S/N) Thanks SON |
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HI All, I'm keep the monitering this issue and update the SWAN FFC Melting device. - 2 more STB was checked. Thanks SON |
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HI All, I'm keep the monitoring this issue and update the SWAN FFC Melting device. - add 1 more case. So far we found 4pcs of FFC melting STB Thanks SON |
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No more action. So, close this issue. |
| Date Modified | Username | Field | Change |
|---|---|---|---|
| 2022-02-08 13:58 | (ALTech) SH Son | New Issue | |
| 2022-02-08 13:58 | (ALTech) SH Son | Issue Monitored: (ALTech) BY Lee | |
| 2022-02-08 13:58 | (ALTech) SH Son | Issue Monitored: (ALTech) JW Kim | |
| 2022-02-08 13:58 | (ALTech) SH Son | Issue Monitored: (ALTech) Lonnie Kim | |
| 2022-02-08 13:58 | (ALTech) SH Son | Issue Monitored: (ALTech) Philip | |
| 2022-02-08 13:58 | (ALTech) SH Son | Issue Monitored: (ALTech) SH Son | |
| 2022-02-08 13:58 | (ALTech) SH Son | Issue Monitored: (ALTech) Sophie Lee | |
| 2022-02-08 13:58 | (ALTech) SH Son | Issue Monitored: (ALTech) Sun Choul Joung | |
| 2022-02-08 13:58 | (ALTech) SH Son | Issue Monitored: (ALTech) SY Yoon | |
| 2022-02-08 13:58 | (ALTech) SH Son | Issue Monitored: (HW) Sean Chiang | |
| 2022-02-08 13:58 | (ALTech) SH Son | Issue Monitored: (HW) Tom Lee | |
| 2022-02-08 13:58 | (ALTech) SH Son | Issue Monitored: (PM) Dennis Lu | |
| 2022-02-08 13:58 | (ALTech) SH Son | Issue Monitored: (PM) Sheila Tu | |
| 2022-02-08 13:58 | (ALTech) SH Son | Issue Monitored: (PM) Tiffanie Lai | |
| 2022-02-08 13:58 | (ALTech) SH Son | Issue Monitored: (RD) Fu-chiang Young | |
| 2022-02-08 13:59 | (ALTech) SH Son | Issue Monitored: (PM) Carey Lu | |
| 2022-02-08 14:25 | (SW) Jacky Chiang | Assigned To | => (HW) Sean Chiang |
| 2022-02-08 14:25 | (SW) Jacky Chiang | Status | new => assigned |
| 2022-02-08 14:25 | (SW) Jacky Chiang | Severity | s2-severe => s3-moderate |
| 2022-02-08 14:34 | (ALTech) SH Son | File Added: [SWAN] AMP FFC and Common mode Filter is malting issue .pdf | |
| 2022-02-08 14:34 | (ALTech) SH Son | File Added: EX775967757835.PDF | |
| 2022-02-08 14:34 | (ALTech) SH Son | File Added: CI775967757835.PDF | |
| 2022-02-08 14:34 | (ALTech) SH Son | Note Added: 0009404 | |
| 2022-02-10 19:24 | (HW) Tom Lee | File Added: Field issue_CM choke burned_FFC cable melted FA report_Fed-09 V2.pdf | |
| 2022-02-10 19:24 | (HW) Tom Lee | Note Added: 0009430 | |
| 2022-02-11 11:10 | (ALTech) SH Son | Note Added: 0009435 | |
| 2022-02-15 14:24 | (HW) Tom Lee | Note Added: 0009447 | |
| 2022-02-15 14:53 | (ALTech) Lonnie Kim | Note Added: 0009448 | |
| 2022-02-18 18:50 |
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File Added: 96.1531T00- amp board burnout FA report-20220216 v1.pdf | |
| 2022-02-18 18:50 |
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Note Added: 0009476 | |
| 2022-03-09 17:03 | (HW) Sean Chiang | Note Added: 0009572 | |
| 2022-03-09 17:05 | (HW) Sean Chiang | File Added: KZ22030040 胜宏（烧板短路失效分析）(2).pdf | |
| 2022-03-09 17:05 | (HW) Sean Chiang | Note Added: 0009573 | |
| 2022-03-10 15:00 | (ALTech) SH Son | Note Added: 0009577 | |
| 2022-03-10 15:48 | (HW) Sean Chiang | Note Added: 0009578 | |
| 2022-03-10 19:12 | (HW) Tom Lee | File Added: KZ22030040 Victory Giant（Burning plate short circuit analysis）.pdf | |
| 2022-03-10 19:12 | (HW) Tom Lee | Note Added: 0009580 | |
| 2022-03-18 22:52 | (HW) Tom Lee | File Added: Attached file of page6.zip | |
| 2022-03-18 22:52 | (HW) Tom Lee | File Added: FA Report for ALT STB BFX UA300 Choke burned and FFC cable melted_v2.pdf | |
| 2022-03-18 22:52 | (HW) Tom Lee | Note Added: 0009652 | |
| 2022-03-22 14:32 | (ALTech) SH Son | Note Added: 0009668 | |
| 2022-03-22 15:27 | (ALTech) SH Son | Note Edited: 0009668 | |
| 2022-03-22 19:45 | (HW) Tom Lee | Note Added: 0009672 | |
| 2022-03-23 07:47 | (ALTech) SY Yoon | Note Added: 0009673 | |
| 2022-03-24 22:10 | (HW) Sean Chiang | Note Added: 0009699 | |
| 2022-03-28 09:31 | (ALTech) SH Son | Note Added: 0009713 | |
| 2022-03-28 19:36 | (HW) Tom Lee | File Added: 8D Report for ALT STB BFX UA300 Choke burned and FFC cable melted_v2.pdf | |
| 2022-03-28 19:36 | (HW) Tom Lee | Note Added: 0009722 | |
| 2022-03-29 12:22 | (ALTech) SY Yoon | Note Added: 0009726 | |
| 2022-03-29 16:42 | (ALTech) SH Son | File Added: fish born.pptx | |
| 2022-03-29 16:42 | (ALTech) SH Son | Note Added: 0009731 | |
| 2022-03-29 17:49 | (HW) Tom Lee | File Added: 308.03524.055 PCB short to burn analysis report（S47304PNM39D2）-V3.pptx | |
| 2022-03-29 17:49 | (HW) Tom Lee | Note Added: 0009733 | |
| 2022-03-30 19:59 | (HW) Tom Lee | File Added: K18X001.00 verify CM choke_T1, FFC AMP Burn Report 20220330 Ver.pptx | |
| 2022-03-30 19:59 | (HW) Tom Lee | Note Added: 0009753 | |
| 2022-03-31 09:31 | (ALTech) SH Son | File Added: K18X001.00 verify CM choke_T1, FFC AMP Burn Report 20220330 Ver_ALT Feedback_220331_V1.pdf | |
| 2022-03-31 09:31 | (ALTech) SH Son | Note Added: 0009756 | |
| 2022-03-31 11:52 | (HW) Tom Lee | Note Added: 0009761 | |
| 2022-03-31 15:48 | (HW) Tom Lee | Note Added: 0009767 | |
| 2022-04-04 10:42 | (ALTech) SH Son | Note Added: 0009793 | |
| 2022-04-07 13:58 | (HW) Tom Lee | File Added: BPPF00121190172X0F PM-1211-0002-00-(00).pdf | |
| 2022-04-07 13:58 | (HW) Tom Lee | Note Added: 0009834 | |
| 2022-04-12 11:07 | (HW) Tom Lee | File Added: LCPS.pdf | |
| 2022-04-12 11:07 | (HW) Tom Lee | File Added: UL E54705.pdf | |
| 2022-04-12 11:07 | (HW) Tom Lee | Note Added: 0009868 | |
| 2022-04-13 08:42 | (ALTech) Lonnie Kim | Note Added: 0009877 | |
| 2022-04-14 11:43 | (HW) Tom Lee | File Added: K18X001.00 verify CM choke_T1, FFC AMP Burn Report V2 20220413.pdf | |
| 2022-04-14 11:43 | (HW) Tom Lee | Note Added: 0009879 | |
| 2022-04-14 15:05 | (ALTech) SH Son | File Added: 이미지 1248.png | |
| 2022-04-14 15:05 | (ALTech) SH Son | Note Added: 0009883 | |
| 2022-04-14 16:18 | (HW) Tom Lee | Note Added: 0009886 | |
| 2022-04-20 19:10 | (ALTech) Lonnie Kim | File Added: 이미지 1295.png | |
| 2022-04-20 19:10 | (ALTech) Lonnie Kim | Note Added: 0009907 | |
| 2022-04-22 11:50 | (HW) Tom Lee | File Added: 3M tape 12.5x25mm datasheet.pdf | |
| 2022-04-22 11:50 | (HW) Tom Lee | Note Added: 0009913 | |
| 2022-05-27 18:09 | (HW) Tom Lee | File Added: Reliability test report for BFX-UA300 (K18X001T00) v1.0_2022-05-27.pdf | |
| 2022-05-27 18:09 | (HW) Tom Lee | Note Added: 0010082 | |
| 2022-08-02 12:46 | (HW) Tom Lee | Note Added: 0010505 | |
| 2022-08-02 12:46 | (HW) Tom Lee | File Added: K18X001.00 Control Run New Choke Result Report.pdf | |
| 2022-08-04 17:35 | (HW) Tom Lee | Note Added: 0010531 | |
| 2022-08-05 08:37 | (ALTech) SH Son | Note Added: 0010536 | |
| 2023-02-03 16:14 | (ALTech) SH Son | Note Added: 0011999 | |
| 2023-02-03 16:14 | (ALTech) SH Son | File Added: [SWAN] AMP FFC and Common mode Filter is melting issue_v2_230203.pdf | |
| 2023-08-29 11:10 | (ALTech) SH Son | Note Added: 0014012 | |
| 2023-08-29 11:10 | (ALTech) SH Son | File Added: [SWAN] AMP FFC and Common mode Filter is melting issue_v3_230829.pdf | |
| 2023-08-29 11:10 | (ALTech) SH Son | Issue Monitored: (MFG) Rachel Ruan | |
| 2023-08-29 11:10 | (ALTech) SH Son | Issue Monitored: (MFG) An Tran | |
| 2023-08-29 11:11 | (ALTech) SH Son | Issue Monitored: (Sales) Miya Wang | |
| 2023-08-29 13:43 | (HW) Sean Chiang | Issue Monitored: (HW) Cooper Kung | |
| 2023-08-29 13:44 | (HW) Sean Chiang | Issue Monitored: (RD) Jay Lin | |
| 2025-04-11 21:22 | (HW) Sean Chiang | Status | assigned => closed |
| 2025-04-11 21:22 | (HW) Sean Chiang | Resolution | open => fixed |
| 2025-04-11 21:22 | (HW) Sean Chiang | Note Added: 0017467 |
